SLA500 uses SLA (stereoscopic photocuring molding) technology to form a 3D entity by focusing a laser at a specific wavelength and intensity on the surface of a photosensitive resin material, allowing it to be sequentially solidified and cured layer by layer.
SLA technology has the characteristics of good surface quality of formed parts, and is suitable for post-treatment operations such as sandblasting, polishing, spraying and dyeing after curing.
Main technical parameters
Molding range：500×400×300 mm（L×W×H）
